學長姐 Myra Ching 錄取 University of Illinois at Urbana-Champaign (UIUC) Electrical and Computer Engineering, M.Eng.｜留學申請經驗分享、落點分析｜OfferLand
来看看学长学姐的申请经验和结果吧！
Myra Ching
2023-08-28
申请背景
学术背景
学校：
专业：
GPA：3.66 / 4.0
考试成绩
TOEFL：95
GRE：320
申请结果
United States (US)
2023-02-10
学位：Masters
United States (US)
2023-02-10
学位：Masters
United States (US)
2023-02-20
学位：Masters
United States (US)
2023-02-20
学位：Masters
United States (US)
2023-03-01
学位：Masters
United States (US)
2023-03-01
学位：Masters
United States (US)
2023-01-22
学位：Masters
United States (US)
2023-01-22
学位：Masters
United States (US)
2023-01-22
学位：Masters
United States (US)
2023-01-22
学位：Masters
United States (US)
2023-01-22
学位：Masters
United States (US)
2023-01-22
学位：Masters