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清華材料學長姐 Wang Mina 錄取 University of Illinois at Urbana-Champaign (UIUC) Materials Science & Engineering, MS|留學申請經驗分享、落點分析|OfferLand
來看看學長姐的申請經驗和結果吧!
Wang Mina
2024-06-25
申請背景
學術背景
學校:
National Tsing Hua University (NTHU)
科系:
Materials
GPA:
3.91 / 4.3
檢定成績
TOEFL:
93
申請結果
University of Illinois at Urbana-Champaign (UIUC)
錄取
United States (US)
2024-03-19
科系:
Materials Science & Engineering, MS
學位:
Masters
University of Illinois at Urbana-Champaign (UIUC)
錄取
United States (US)
2024-03-19
科系:
Materials Science & Engineering, MS
學位:
Masters
Northwestern University
錄取
United States (US)
2024-03-23
科系:
Materials Science and Engineering
學位:
Masters
Northwestern University
錄取
United States (US)
2024-03-23
科系:
Materials Science and Engineering
學位:
Masters
Johns Hopkins University (JHU)
錄取
United States (US)
2024-03-23
科系:
Materials Science and Engineering, Master of Science
學位:
Masters
Johns Hopkins University (JHU)
錄取
United States (US)
2024-03-23
科系:
Materials Science and Engineering, Master of Science
學位:
Masters
University of Pennsylvania
未錄取
United States (US)
2024-03-22
科系:
Materials Science and Engineering
學位:
Masters
University of Pennsylvania
未錄取
United States (US)
2024-03-22
科系:
Materials Science and Engineering
學位:
Masters
University of California, Irvine (UC Irvine, UCI)
未錄取
United States (US)
2024-03-25
科系:
Materials Science and Engineering
學位:
Masters
University of California, Irvine (UC Irvine, UCI)
未錄取
United States (US)
2024-03-25
科系:
Materials Science and Engineering
學位:
Masters
University of Washington (UW)
未錄取
United States (US)
2023-01-22
科系:
Materials Science & Engineering MS - Applied
學位:
Masters
University of Washington (UW)
未錄取
United States (US)
2023-01-22
科系:
Materials Science & Engineering MS - Applied
學位:
Masters
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